(The 22nd) 2026 Hot Melt Adhesive Development Forum Final Programme

Industry news
2026-03-12

 

Shangri-La Suzhou
March 23-25, 2026

Theme: Collaborate to Drive Innovation for the Stable Growth of Hot Melt Adhesive Industry

Sponsors: Henghe Materials & Science Technology Co., Ltd.
Tex Year Group
NETZSCH Scientific Instruments (Shanghai) Ltd.
Guangxi Dinghong Resin Co., Ltd.
Waters Technology (Shanghai) Co., Ltd.
Hubei Huifu Nanomaterial Co., Ltd.
Sunture Industrial (Wuxi) Co., Ltd.

No.

Time

Presentation Title

Speaker

09:00-09:10

Welcome Speech

1

09:10-09:50

Keynote Speech: Retrospect and Prospect: An Analysis of China's Hot Melt Adhesive Market in 2025

Zhao Qingfang, President, China Adhesives and Tape Industry Association

General Manager, Hangzhou Renhe Hot Melt Adhesive Co., Ltd.

2

09:50-10:30

Henkel Sustainable Adhesive Solutions for Hygiene ProductsSelina Deng, Senior R&D Specialist - Adhesives for Consumer Goods Market, Henkel (China) Investment Co., Ltd.

10:30-10:50

Coffee Break

Exhibition Exchange

3

10:50-11:35

Radiation Resistance · Temperature Tolerance · High Specific Energy: Hot Melt Adhesive Film Pioneers the Customized Development of Encapsulation Materials for Space Photovoltaics.Chen Lei, General Manager/Chief Engineer, Jiangsu Lushan New Materials Co., Ltd.

11:35-12:30

Guest Interview: Innovation and Development of Key Raw Materials for Hot Melt Adhesive and Hot Melt Pressure Sensitive Adhesive; Innovative Technology and Application of Hot Melt Adhesive and Hot Melt Pressure Sensitive Adhesive

Chaired by: Zheng Renfeng, Director of the Research Institute, Tianyang New Materials (Shanghai) Technology Co., Ltd.

Registration Date: 9:00-22:00 on March 23rd, 2026 (Monday)
Registration Venue: 168 Ta Yuan Road, Huqiu District, Suzhou, Jiangsu Province

March 24th, 2026 (Tuesday), 09:00-12:30
Venue: Grand Ballroom I+II+III, 2nd Floor
Chair: TBA

No.

Time

Presentation Title

Speaker

09:00-09:10

Welcome Speech

1

09:10-09:50

Keynote Speech: Retrospect and Prospect: An Analysis of China's Hot Melt Adhesive Market in 2025

Zhao Qingfang, President, China Adhesives and Tape Industry Association

General Manager, Hangzhou Renhe Hot Melt Adhesive Co., Ltd.

2

09:50-10:30

Henkel Sustainable Adhesive Solutions for Hygiene ProductsSelina Deng, Senior R&D Specialist - Adhesives for Consumer Goods Market, Henkel (China) Investment Co., Ltd.

10:30-10:50

Coffee Break

Exhibition Exchange

3

10:50-11:35

Radiation Resistance · Temperature Tolerance · High Specific Energy: Hot Melt Adhesive Film Pioneers the Customized Development of Encapsulation Materials for Space Photovoltaics.Chen Lei, General Manager/Chief Engineer, Jiangsu Lushan New Materials Co., Ltd.

11:35-12:30

Guest Interview: Innovation and Development of Key Raw Materials for Hot Melt Adhesive and Hot Melt Pressure Sensitive Adhesive; Innovative Technology and Application of Hot Melt Adhesive and Hot Melt Pressure Sensitive Adhesive

Chaired by: Zheng Renfeng, Director of the Research Institute, Tianyang New Materials (Shanghai) Technology Co., Ltd.

March 24th, 2026 (Tuesday), 14:00-18:00
Venue: Grand Ballroom I+II+III, 2nd Floor
Chair: Li Yunlong, Director, Hangzhou Zhijiang Silicone Chemicals Co., Ltd.

No.

Time

Presentation Title

Speaker

4

14:00-14:30

The Green Evolution of Hot Melt Adhesives: Enabling a New Low-Carbon Ecosystem with Green TechnologyZeng Huai, Senior R&D Manager, Tex Year Group

5

14:30-15:00

Driven by Smart Manufacturing, Empowering the Future of BrandsYu Pengcheng, General Manager, Shenzhen Xuyong Industry Co., Ltd.

6

15:00-15:30

Functional Additive for Adhesives — HIFULL® Fumed NanomaterialsXie Jincheng, Technical Manager, Hubei Huifu Nanomaterial Co., Ltd.

7

15:30~16:00

Study on the Rheological and Curing Characteristics of Hot Melt AdhesiveLiu Ping, Technical Support Engineer Rheometry, NETZSCH Scientific Instruments (Shanghai) Co., Ltd.

16:00-16:30

Coffee Break

Exhibition Exchange

8

16:30-17:00

Properties and Applications of Medical Pressure Sensitive AdhesiveLiu Chenggang, Senior Engineer, Zhende Medical Co., Ltd.

9

17:00-17:30

Hot Melt Adhesive Technology and Prospects for Flow BatteriesWang Xilong, Vice President, Zhejiang Star New Energy Technology Co., Ltd.

10

17:30-18:00

PUR Green Bonding Technology, Platform-Based Empowerment for Multi-Scenario ApplicationsHunter Shu, Deputy General Manager of Adhesive Division, BATF Group Co., Ltd.

March 25th, 2026 (Wednesday), 09:00-12:30
Venue: Grand Ballroom I+II, 2nd Floor
Hot Melt Adhesive Application Technology Track
Chair: Chen Shi, Technical Director, Foshan Rurga New Material Technology Co., Ltd.

No.

Time

Presentation Title

Speaker

11

09:00-09:30

Hot Melt Adhesive Technology and Sustainable Solutions for the Packaging IndustryWu Tan, R&D Manager, Adhesives for Packaging Market, Asia Pacific, Henkel (China) Investment Co., Ltd.

12

09:30-10:00

Solid Acrylic Resin Solutions from Roehm Chemical for the Adhesive IndustryHarvey Gu, Applications Technology Manager, Roehm Chemical (Shanghai) Co., Ltd.

13

10:00-10:30

Innovative Applications of PUR in the Textile IndustryChen Qinyue, R&D Engineer, H.B. Fuller (China) Adhesives Ltd.

10:30-11:00

Coffee Break

Exhibition Exchange

14

11:00-11:30

Applications and Promotion of Hot Melt Pressure Sensitive Adhesives in the Pest Control IndustryChen Ensheng, Technical Manager, Chengdu Guibao Science & Technology Co., Ltd.—Jiangsu Jaour Hot Melt Adhesive Co., Ltd.

15

11:30-12:00

Case Study on Hot Melt Pressure Sensitive Adhesive for Medical NonwovensWei Jingjing, R&D Engineer, Kangda New Materials (Group) Co., Ltd.

16

12:00-12:30

Enhancing the Wet Strength of Pressure Sensitive Adhesives with Maleic Anhydride Grafted Rosin Based Tackifying Resin (MGL Resin)Zheng Xiaolin, General Manager, Hangzhou Guanjia Plastic & Chemical Co., Ltd./Lejing New Materials (Zhejiang) Co., Ltd.

March 25th, 2026 (Wednesday), 09:00-12:30
Venue: Grand Ballroom III, 2nd Floor
Innovative Raw Materials and Equipment for Hot Melt Adhesive Track
Chair: Peng Jun, Deputy R&D Director, Focus Hotmelt Company Ltd.

No.

Time

Presentation Title

Speaker

17

09:00-09:30

Enhancing Bonding Reliability for Difficult-to-Bond Substrates: A Bonding Performance Optimization Solution with Licocene™ High Performance PolyolefinsTim Saddow, Global Marketing Director for the Adhesive Business, Clariant Chemicals (China) Ltd.

18

09:30-10:00

TSRC SBC Hot Melt Adhesive SolutionJason Zhu, Technical Service Manager, TSRC (Nantong) Industries Ltd.

19

10:00-10:30

Rheological Characterization of Hot Melt AdhesiveHoward Han, General Manager, Shanghai Lijing Scientific Instrument Co., Ltd.

10:30-11:00

Coffee Break

Exhibition Exchange

20

11:00-11:30

Adhesion Challenges in Recycled Substrates: How Functional Polymers Enable Performance on Evolving Packaging MaterialsMax Yang, Technical Service and Development Manager, Dow (Shanghai) Investment Co., Ltd.

21

11:30-12:00

Microscopic Perspective on Material Molecular Motion — Key Applications of Low Field NMR in R&D and Quality ControlLiu Jiajun, Product Manager, Suzhou Niumag Analytical Instrument Co., Ltd.

22

12:00-12:30

Next Generation Hot Melt Adhesives Based on Microcapsules: Exploring Curing, Disassembly, and Low Carbon InnovationAn Jinliang, Chief Technology Officer, Guangzhou New Materials Intelligent Technology Co., Ltd. (NMI)

March 25th, 2026 (Wednesday), 14:00-17:00
Venue: Grand Ballroom I+II, 2nd Floor
Reactive Hot Melt Adhesive Technology Track
Chair: Cong Helei, Senior Engineer, Kangda New Materials (Group) Co., Ltd.

No.

Time

Presentation Title

Speaker

23

14:00-14:30

Applications of PUR Hot Melt Adhesives in Kitchen AppliancesXu Xin, Process Engineer, Ningbo FOTILE Kitchen Ware Co., Ltd.

24

14:30-15:00

Exploring the Development, Integration, and Application Challenges of PUR and Corresponding SolutionsXu Botao, R&D Director, Beijing Comens New Materials Co., Ltd.

25

15:00-15:30

Application of Reactive Butyl Hot Melt Adhesive in Advanced Photovoltaic ModulesDr. Huang Bowen, Guangzhou Baiyun Technology Co., Ltd.

15:30-16:00

Coffee Break

Exhibition Exchange

26

16:00-16:30

Focusing on PUR Characteristics—The Application Wisdom of Joya Hot Melt AdhesivesQian Weiwei, Technical Director, Zhejiang Joya Polymer Technology Co., Ltd.

27

16:30-17:00

Application of Analytical Techniques in the Development of Polyurethane AdhesiveHu Feilong, Technical Director, Suzhou He-Chuan Chemical Technology Service Co., Ltd.

March 25th, 2026 (Wednesday), 14:00-17:00
Venue: Grand Ballroom III, 2nd Floor
UV Hot Melt Adhesive Technology Track
Chair: Anthony Li, Vice President, Color Saint (Shanghai) New Material Co., Ltd.

No.

Time

Presentation Title

Speaker

28

14:00-14:30

Innovation Driving Development: The History and Future of BASF acResin® UV-Curable Hot Melt AdhesivesEddie Liu, Senior Manager of Research & Development and New Business Development, BASF (China) Co., Ltd.

29

14:30-15:00

Application of Rheology in Performance Evaluation of AdhesiveDr. Li Runming, Principal Scientist, TA Instruments, China Region, Waters Technology (Shanghai) Co., Ltd.

30

15:00-15:30

Domestic Alternatives for Imported UV EquipmentYue Chengliang, General Manager, Wuhan CNRAY Technology Co., Ltd.

15:30-16:00

Coffee Break

Exhibition Exchange

31

16:00-16:30

Comprehensive Guide to UV Curing Equipment and Process SelectionJames Li, General Manager, Qingyang Technology (Chongqing) Co., Ltd.

32

16:30-17:00

Application Research on UV Acrylate Hot Melt Pressure Sensitive Adhesive for Double-Transparent LabelsGao Fugang, Technical Manager, Dongguan CO-MO Adhesives Co., Ltd.