Selected list of Adhesive and Tape Invention Patents (Mar 27 – Apr 2, 2026)

1. High-Temperature Anti-Bubble UV-Curable Acrylic Adhesive, Adhesive Film for PC Boards and Preparation Method Thereof

Applicants: Sdic New Material (Jiangsu) Co., Ltd.; Jiangsu Sdic New Material Technology Co., Ltd.

Publication No.: CN121759119A

Publication Date: Mar 31, 2026

Abstract:

The invention discloses a high-temperature anti-bubble UV-curable acrylic adhesive, adhesive film for PC boards and preparation method thereof. The adhesive comprises the following raw materials: butyl acrylate, hydroxyethyl acrylate, acrylamide, 1,6-hexanediol diacrylate, tackifying resin and photoinitiator, wherein the tackifying resin is modified polyurethane acrylate.

The prepared adhesive features excellent appearance, good thermal stability, high temperature resistance without bubbling and outstanding optical properties, with stable adhesion to PC boards, thus having broad market application prospects.

By using specially modified polyurethane acrylate as the tackifying resin, the adhesive formula provides excellent adhesion and heat resistance, and improves bonding performance and high-temperature resistance.

2. Self-Leveling, High Thermal Conductivity, Low Density Two-Component Epoxy Potting Compound and Preparation Method Thereof

Applicants: Hangzhou Zhijiang Silicone Chemicals Co., Ltd.; Hangzhou Zhijiang New Materials Co., Ltd.

Publication No.: CN121759130A

Publication Date: Mar 31, 2026

Abstract:

The invention provides a self-leveling, high thermal conductivity, low density two-component epoxy potting compound and preparation method thereof. The product is prepared from Component A and Component B at a mass ratio of 10: (0.8–1.2). All parts are by weight.

Component A comprises: 25–30 parts of epoxy resin, 100–150 parts of composite thermal conductive filler, 1–4 parts of low-density hollow microspheres, 1–5 parts of thixotropic agent, 1–8 parts of diluent, 0.5–2 parts of defoamer. The weight ratio of the first thermal conductive filler to the second is (80–130): (10–55).

Component B comprises: 14–19 parts of curing agent, 0.5–2 parts of curing accelerator, wherein the curing agent is an amine curing agent.

Through a well-designed composite system of multiple thermal conductive fillers and density-reducing fillers, the invention ensures the potting compound has a density below 2.0 g/cm³ (measured up to 1.81 g/cm³) and achieves an excellent thermal conductivity above 1.5 W/(m·K) (measured up to 1.77 W/(m·K)), effectively solving the contradiction between high thermal conductivity and low density.

3. EPE Film Based on Low-Temperature and High-Temperature Dual Curing, Preparation Method Thereof and Photovoltaic Module

Applicant: Jiangsu Lushan New Materials Co., Ltd.

Publication No.: CN121736654A

Publication Date: Mar 27, 2026

Abstract:

The invention relates to the technical field of photovoltaic packaging composite materials, in particular to an EPE film based on low-temperature and high-temperature dual curing, preparation method thereof and photovoltaic module.

The dual-cured EPE film comprises a first EVA layer, a POE layer and a second EVA layer arranged in sequence.

The first EVA layer comprises maleic anhydride grafted EVA resin, first EVA resin, crosslinking agent, silane coupling agent and antioxidant.

The second EVA layer comprises second EVA resin, crosslinking agent, polyalkenyl compound, silane coupling agent and antioxidant.

The POE layer comprises glycidyl methacrylate modified POE resin, mercapto-modified POE resin, POE resin, crosslinking agent, silane coupling agent and antioxidant.

In the EPE film of the invention, the POE layer can be partially crosslinked at low temperature, and the EVA layer and POE layer can undergo crosslinking reaction at high temperature, thereby significantly improving the long-term reliability of the module.

4. Two-Component Silicone Sealant, Preparation Method and Application Thereof

Applicants: Guangzhou Jointas Chemical Co., Ltd.; Guangzhou Conghua Zhaoshun New Materials Co., Ltd.

Publication No.: CN121736693A

Publication Date: Mar 27, 2026

Abstract:

The invention relates to the technical field of polymer materials, and discloses a two-component silicone sealant, preparation method and application thereof.

The two-component silicone sealant comprises the following components in parts by mass:

Component A: 80–120 parts of α,ω-dihydroxy polydimethylsiloxane, 5–20 parts of self-healing microcapsules, 5–20 parts of plasticizer, 5–50 parts of reinforcing filler, 0.01–0.5 parts of catalyst.

Component B: 80–120 parts of alkoxy-terminated polydimethylsiloxane, 0–20 parts of self-healing microcapsules, 5–20 parts of plasticizer, 5–50 parts of reinforcing filler, 2–20 parts of crosslinking agent, 1–10 parts of coupling agent.

The core material of the self-healing microcapsules comprises a mixture of hydroxyl-terminated polysiloxane and organotin catalyst.

The self-healing effect of the two-component silicone sealant relies on the synergistic effect of the repairing components and the controlled-release structure of the microcapsules, solving the industry problems of irreversible damage and high maintenance cost of traditional sealants, and significantly improving its long-term service reliability and service life in harsh environments.

5. High and Low Temperature Resistant Epoxy Adhesive for Bonding Complex Components in Aerospace Field and Preparation Method Thereof

Applicant: Petrochemical Research Institute of Heilongjiang Academy of Sciences

Publication No.: CN121736681A

Publication Date: Mar 27, 2026

Abstract:

The invention relates to a high and low temperature resistant epoxy adhesive for bonding complex components in the aerospace field and preparation method thereof, belonging to the field of new aerospace materials. It aims to solve the problem that existing epoxy adhesives are difficult to maintain high bonding strength in a wide temperature range.

The epoxy adhesive consists of Part A and Part B.

Part A is prepared from liquid epoxy resin, aromatic heterocyclic epoxy resin, super-tough resin and inorganic filler.

Part B is prepared from aromatic amine, modified alicyclic amine, polymer particles and thixotropic agent.

Preparation method: mix liquid epoxy resin and aromatic heterocyclic epoxy resin, then add super-tough resin and inorganic filler to obtain Part A; mix aromatic amine and modified alicyclic amine, then add polymer particles and thixotropic agent to obtain Part B.

The adhesive of the invention can maintain high bonding strength for various materials in a wide temperature range from -160°C to 230°C. It is used for bonding complex components in the aerospace field.